Myth Project
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Everything posted by Myth Project
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Hmmm, didn't think of searching lollipop... I tried searching backside and/or underside surfacing and didn't get any hits. Good idea htm01!
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I'm guessing no one else knows how to do this either? Lol. Well ain't this the suck...
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Diffrent size part clockwise counter clockwise
Myth Project replied to NORMG's topic in Machining, Tools, Cutting & Probing
Climb milling the tool deflects away from the part, conventional milling the tool deflects into the part, or digs. As previously stated, climb milling is preferred in most cases. -
Cant get MOO to post at end of Operation
Myth Project replied to StoneyNH's topic in Industrial Forum
I didn't know I could make MCX8 output an M00 by changing a misc value. I tried it and it didn't work... The attached file, this is where I should change the value, correct??? (sorry, don't know how to attach thumbnails lol) test.bmp -
Which Drill Bit Material do your Prefer?
Myth Project replied to Jason @ CPM Industries's topic in Industrial Forum
Our shop will use cobalt, HSS, powdered metal and carbide. I personally tend to lean to the carbide because I like ripping holes without pecking and without center drilling. Carbide drill speeds and feeds, without pecking greatly increases productivity. Dealing with the numbers you're talking about, carbide all day buddy. -
How would one go about creating an underside surface or backside surface code in MCX8? I'm not using a 5 axis machine. What I'm going for is: using an 1/8" lollipop endmill to deburr or radius the intersection of 2 holes in a 3 axis VMC. As of right now, the only way I know to create an underside or backside surface is by drafting the toolpath lines by hand and having the tool follow the path directly, but THERE MUST BE A BETTER WAY! Lol. Thanks in advance for any and all help.
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Thanks for the advice. I've now downloaded the HSM Adivisor and I'm going to play with it some. The little bit that I've looked at it since download looks very interesting. I wish I knew more of the mathematics behind the formulas they are using to calculate their data so I could further understand the entire process. But, I'm sure I'll get by with solutions provided for now.
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I like the formulas that y'all have provided, but I have a couple of "?'s"... First, does step over and step down work the same in calculating chip thinning? (ie: helix boring a .094" hole with a .0625 4FL EM with a .002 RGH Pitch) Second, does it change even more if one were using a .01 corner radius on the 1/16" EM? Lastly, how would one go about calculating such variables??? Sorry, not trying to thread jack, just trying to expand on the whole "Chip Thinning" information. Thanks
